作者:周源/华尔街见闻 自新CEO陈立武上任以来,英特尔基本盘看来日益稳固,而新技术也进展颇大。 最近,英特尔在电子元件技术大会(ECTC)上披露了多项芯片封装技术突破,尤其是EMIB-T,用于提升芯片封装尺寸和供电能力,以支持HBM4/4e等新技术。 此外还包括新分散式散热器设计和新的热键合技术,可提高可靠性和良率,并支持更精细的芯片间连接。 EMIB-T(Embedded Multi-die ...
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