【意法半导体与高通合作开发的Wi-Fi/蓝牙二合一无线模块正式量产】意法半导体宣布,Wi-Fi 6和低功耗蓝牙5.4二合一模块ST67W611M1正式进入量产阶段。该模块是意法半导体与高通科技公司于2024年宣布的合作项目的首款产品,能够降低在基于STM32微控制器(MCU)的应用系统中实现无线连接的难度。

金融界
05 Jun
意法半导体宣布,Wi-Fi 6和低功耗蓝牙5.4二合一模块ST67W611M1正式进入量产阶段。该模块是意法半导体与高通科技公司于2024年宣布的合作项目的首款产品,能够降低在基于STM32微控制器(MCU)的应用系统中实现无线连接的难度。

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