开源通信||博通TH6交换芯片量产上市,持续看好AI算力产业链

新颖科技前沿
08 Jun

核心观点1.1、博通全球首款102.4Tbps交换芯片TH6量产上市,重视AI算力基建投资新浪潮2025 年 6 月 3 日博通公司(AVGO)宣布发货 Tomahawk 6 交换芯片,单芯片交换容量达102.4Tbps,是当前以太网交换机带宽的2倍,为下一代纵向扩展和横向扩展 AI 网络提供支持,支持 100G/200G SerDes 和共封装光学器件 (CPO),提供业界最全面的 AI 路由...

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