【中信证券：博通新一代交换芯片交付，关注光通信机遇】金十数据6月5日讯，中信证券研报称，近日，博通透露其新一代Tomahawk 6交换芯片已启动交付，目前客户需求十分旺盛。Tomahawk 6性能提升显著，可以支持百万XPU的集群部署。我们认为网络速率升级与算力集群扩张依然是长期发展趋势，Tomahawk 6的量产有望推动1.6T光模块与数据中心互联（DCI）需求的快速增长。同时此次Tomahawk 6亦发布了共封装光学技术(CPO)版本，有望推动CPO方案的成熟。因此我们认为深入布局高速数通模块、DCI互联与CPO方案的光模块/器件厂商有望受益。
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