金融界2025年6月7日消息，国家知识产权局信息显示，意法半导体国际公司申请一项名为“具有包括污染减少结构的外部流体耦合的微机电传感器”的专利，公开号CN120101846A，申请日期为2024年12月。
专利摘要显示，本公开的实施例涉及具有包括污染减少结构的外部流体耦合的微机电传感器。微机电传感器包括：支撑体，支撑体包含半导体材料；以及覆盖件，覆盖件是半导体材料的，覆盖件被耦合到支撑体并且具有支撑体布置的内表面、以及多个入口孔。传感器还包括感测结构，感测结构包括测量室和敏感元件，敏感元件被至少部分地形成在支撑体中并且面向测量室；流体路径，流体路径被配置为穿过入口孔将感测结构与传感器外部的环境耦合，并且具有到测量室的进入区段；以及捕获结构，捕获结构被限定在支撑体中。捕获结构与相应的流体连通连通，并且以相对于每个流体路径的进入区段距覆盖件的内表面更大的距离至少部分地在支撑体中延伸。
Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.