格芯大手笔投资,台积电晶圆厂延期,全球晶圆代工风云又起

全球半导体观察
06 Jun

美国当地时间6月4日,格芯(GlobalFoundries)宣布将投资160亿美元,增强在半导体制造和先进封装领域的实力。这笔投资将推动基础芯片制造回流,重点投入纽约和佛蒙特州的工厂。其中,超130亿美元用于扩建现有工厂,以及为纽约先进封装和光子中心提供资金;30亿美元用于封装创新、硅光子技术及下一代氮化镓(GaN)技术的研发。格芯表示,此次投资是对人工智能(AI)迅猛发展的战略响应。随着AI在...

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