(信息来源:tomshardware)美国芯片巨头英特尔已与日本科技和投资巨头软银携手,合作开发一种堆叠式DRAM,以替代高带宽存储器(HBM)。据《日经亚洲》报道,这两家行业巨头联合成立了一家名为 Saimemory 的公司,致力于基于英特尔的技术与东京大学等日本高校的专利,共同打造原型芯片。该公司计划于 2027年完成原型开发并评估量产可行性,目标是在 2030年前实现商业化。目前,大多数AI...
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