台积电美国晶圆厂建设加速,A16/N2芯片拟提前半年投产

SEMI
Jun 12, 2025

据台媒报道,台积电将加速其在美子公司TSMC Arizona的建厂和量产,第二、第三晶圆厂进度较先前计划提前半年左右。据悉,TSMC Arizona第三晶圆厂已于今年4月末破土动工,将在本十年内提供N2、A16先进制程产能;而更早开建的3nm工艺第二晶圆厂则原定于2028年投产。而由于市场需求和新厂建置资源分配的实际情况,台积电在日本、欧洲合资企业JASM和ESMC的晶圆厂建设速度则会放缓。点击...

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