智通财经APP获悉，据报道，本田汽车(HMC.US)将加入丰田汽车、日本政府等其他支持者的行列，向日本半导体制造商Rapidus投资数十亿日元。这项投资预计在本田2025/2026财年的下半年进行，旨在确保下一代国产汽车芯片的稳定供应。
力争实现尖端半导体的国产化的Rapidus将在2025财年从日本政府获得最多8025亿日元的额外支持。试制生产线所需的约2万亿日元资金已有眉目，北海道千岁市的工厂4月1日开始运行。要想在2027年实现量产，还需要追加3万亿日元规模的资金，因此必须要吸引民间资金。Rapidus计划在2025年下半年进一步筹集1000亿日元。除了8家现有股东的追加出资外，富士通等企业也表现出出资的意向。未来还将与IT等领域的有可能运用2nm芯片的日本国内企业进行谈判。
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