台积电CoPoS封装技术聚焦AI与高性能计算,明年首设实验线

爱集微
Jun 11, 2025

继CoWoS之后,台积电“以方代圆”的CoPoS封装技术成为市场关注焦点。据业内消息,台积电计划于2026年设立首条CoPoS实验线,地点选在旗下采钰公司,而真正用于大规模生产的量产厂也已确定将建在嘉义AP七,目标是在2028年底至2029年间实现大规模量产。台积电的CoPoS是一种类似“矩形”的CoWoS-L或CoWoS-R技术的变形概念,与传统圆形相比,在基板可利用空间增加的情况下,可以提高...

Source Link

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

Most Discussed

  1. 1
     
     
     
     
  2. 2
     
     
     
     
  3. 3
     
     
     
     
  4. 4
     
     
     
     
  5. 5
     
     
     
     
  6. 6
     
     
     
     
  7. 7
     
     
     
     
  8. 8
     
     
     
     
  9. 9
     
     
     
     
  10. 10