【CNMO科技消息】半导体工艺升级带来的成本压力,可能将持续向终端消费市场传导。6月12日,业内消息人士透露,高通下一代旗舰移动平台SM8950(预计为第三代骁龙8至尊版移动平台)将全面采用台积电2nm制程,并可能推出双版本策略(第二款移动平台暂且称呼为SM8945),定位类似苹果A系列芯片的“标准版与Pro版”组合。这一变动或将导致2026年底发布的新一代旗舰手机面临显著成本上涨,部分机型可能...
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