【台积电嘉义先进封装厂或推迟设备进机】金十数据6月9日讯，台积电(TSM.N)嘉义先进封装AP7厂原计划第三季度设备进机，供应链近期陆续收到延后至第四季度进机通知。日前该厂区发生两起安全事件导致停工。该厂区第一阶段将建设晶圆级多芯片模组（WMCM）封装产能，外界推测，这项封装技术将最先应用于苹果的自研芯片上。
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