三星电子战略议题聚焦先进半导体封装和机器人业务

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据韩媒报道,三星电子将“加强先进半导体封装竞争力”和“强化机器人业务战略”列为2025年6月17日至19日全球战略会议的核心议题。此次会议中,先进封装和机器人都被列入由首席技术官主持的重要议程。过去,封装通常被视为半导体“后端工艺”,相较晶圆上集成电路的“前端工艺”关注度较低。但随着电路微型化趋于瓶颈、制造工艺难度不断上升,全球半导体行业正逐步将先进封装作为技术突破口。在提升封装技术的详细战略中还...

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