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IT之家 6 月 13 日消息，AMD 在 Advancing AI 2025 大会上预览介绍了搭载下一代 Instinct MI400 显卡加速器的 Helios AI 机架解决方案。

而该系统除实际性能升级外的另一大变化就是其宽度从 1 个机架提升到了 2 个机架：

"Helios" 的竞争对手是英伟达的 Vera Rubin NVL144 机架系统，后者并未像 "Helios" 这样横向物理扩展。

▲ "Helios" 的对手是 "Oberon"

▲ 注意机架示意图右下方的小字，写有 "Oberon Rack"

AMD 公司副总裁、数据中心 GPU 总经理 Andrew Dieckmann 表示，增加机架宽度的决定是与关键合作伙伴一道作出的，大型数据中心中的关键限制因素往往是功耗而不是占地面积，双机架的宽度在复杂性、可靠性和性能间实现了平衡。

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