6英寸晶圆厂,拟被抛售

天天IC
16 Jun

集微网·爱集微APP,各大主流应用商店均可下载近年来,随着中国大陆厂商在第三代半导体碳化硅(SiC)领域的快速突破,全球SiC市场格局正悄然重塑。特别是在2023年,中国大陆率先打破产出瓶颈,不仅显著提升供货稳定性,也拉低了整体成本,进一步推动SiC产品走向规模化、商业化。与此同时,一些在技术或成本上缺乏竞争力的厂商,逐渐被边缘化,面临“断舍离”的抉择。近日产业链消息指出,一家欧洲一级汽车零部件...

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