【CNMO科技消息】据中国台湾《工商时报》报道,台积电已开始接受2nm晶圆订单,但首批采用该先进制程的芯片预计要到2025年底才会亮相。传闻称,苹果如往常一样抢先锁定该新技术,其下一代旗舰芯片A20将采用台积电2nm工艺,并率先导入WMCM(晶圆级多芯片模块)封装技术,带来性能与能效的双重跃升。据悉,iPhone 18 Pro、iPhone 18 Pro Max以及传闻中的iPhone 18 ...
Source Link【CNMO科技消息】据中国台湾《工商时报》报道,台积电已开始接受2nm晶圆订单,但首批采用该先进制程的芯片预计要到2025年底才会亮相。传闻称,苹果如往常一样抢先锁定该新技术,其下一代旗舰芯片A20将采用台积电2nm工艺,并率先导入WMCM(晶圆级多芯片模块)封装技术,带来性能与能效的双重跃升。据悉,iPhone 18 Pro、iPhone 18 Pro Max以及传闻中的iPhone 18 ...
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