金融界2025年6月14日消息,国家知识产权局信息显示,苏州博枫智能科技有限公司申请一项名为“一种半导体基板激光切割固定治具”的专利,公开号CN120133713A,申请日期为2025年03月。专利摘要显示,本发明公开了一种半导体基板激光切割固定治具,本发明涉及基板激光切割技术领域,包括固定壳,所述固定壳的一端侧壁固定连接有第一电机,所述固定壳的内壁转动连接有固定框,所述第一电机的输出端贯穿固定壳...
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