玻璃基板,陷入白热化

半导体产业纵横
Jun 13, 2025

一块厚度不足毫米的玻璃板,正引发英特尔、三星和台积电之间一场静悄悄的竞赛。在这场激烈的AI 芯片 “封装竞赛” 赛道上,三星正有条不紊地推进其玻璃中介层战略布局。近日有消息称,三星电子拟定于2028 年前实现玻璃中介层的正式应用,用以替换当下的硅中介层技术。值得关注的是,即便玻璃中介层已成为行业探索的新方向,三星的发展路线却独树一帜。不同于业内广泛采用510x515 毫米规格大尺寸玻璃面板的做法,...

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