AMD确认MI350X AI芯片将采用三星/美光HBM3E

爱集微
13 Jun

AMD的新款人工智能(AI)加速器MI350系列将搭载三星电子12层HBM3E芯片。这对于三星电子来说是一个好消息,因为三星电子在英伟达的HBM认证方面一直遭遇拖延。此外,人们对AMD将于明年推出的下一代MI400系列HBM4的供应也寄予厚望。6月12日,在圣何塞会议中心举行的AI Advancing 2025大会上,AMD宣布其新款AI加速器MI350X和MI355X将搭载三星和美光的12层...

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