中信建投研报称年初DeepSeek发布R1性能媲美OpenAI o1并通过诸多优化手段实现了算力成本的大幅降低成本降低为

智通财经
Jun 19, 2025
中信建投研报称年初DeepSeek发布R1性能媲美OpenAI o1并通过诸多优化手段实现了算力成本的大幅降低成本降低为推理应用突破提供了基础AI在云侧、端侧的赋能开始显现。英伟达GB200、CSP自研ASIC放量GB300、HBM4商业化酝酿中算力基础设施持续迭代。端侧AI应用商业化提速AI手机、AI PC渗透率快速提升智能车、机器人、可穿戴(XR、AI眼镜、耳机)、智能家居等正进行AI化升级。AI快速迭代带来算力需求快速增长先进制程、先进封装、先进存储需求高涨相关厂商积极扩产。国内传统半导体的国产化率较高但高端芯片自给受限高端产能亟需突破重点关注国产先进制程、先进存储、先进封装、核心设备材料、EDA软件等。

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