港交所门前来了位国产半导体封装小巨人。近日,深圳创智芯联科技股份有限公司(以下简称“创智芯联”)正式向港交所递交招股书,在创业20年后冲刺IPO。据悉,创智芯联曾于2023年12月启动A股IPO辅导,但在2025年5月撤回上市辅导,如今选择在港股申请上市。创智芯联是目前国内全方位提供晶圆级封装所有湿制程功能型材料以及关键技术的系统供应商,专注于半导体芯片先进封装、载板及PCB等功能型湿电子材料表面...
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