扇出型面板级封装被誉为下一代先进封装显学,晶圆代工龙头台积电、半导体封测一哥日月光、存储封测龙头力成等半导体三强都积极卡位,抢食英伟达、AMD等大厂庞大的高性能计算芯片高整合先进封装商机。半导体三强扇出型面板级封装领域大进击,各有盘算,引爆新一波抢单大战。据传,台积电相关技术名为CoPoS(Chip-on-Panel-on-Substrate),产能将落脚嘉义,预计2026年设立实验线。日月光在...
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