人工智能重塑全球半导体格局 区域分化加剧自研芯片提速

e公司
Jun 17, 2025

在地缘因素持续动荡与人工智能技术竞赛的背景下,全球半导体产业面临重塑。在日前集邦咨询主办的“TSS 2025半导体产业高层论坛”上,行业分析师指出,尽管AI算力需求激增为市场注入动能,但供应链区域化、关税政策不确定性及产能结构性调整正重塑行业格局,晶圆代工厂区域分化将加剧。同时,在英伟达等算力巨头需求推动下,HBM(高带宽内存)迭代快速,市占率急速提高,产生的排挤效应正在重塑内存行业供给格局;在...

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