（信息来源：thebell）三星电子和SK海力士计划在今年下半年量产的下一代高带宽存储器（HBM），其生产成本将大幅上升。这主要受到核心裸晶（core die）尺寸增加导致单位晶圆可产芯片数（net die）减少，以及基础裸晶（base die）外包代工的影响。业内人士指出，SK海力士、三星电子等企业难以将增加的HBM成本完全转嫁给客户。因为美光（Micron）开始向英伟达供应HBM，打破了SK...
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