智通财经APP获悉，微软(MSFT.US)周二宣布与超微半导体(AMD.US)达成多年期合作协议，双方将为这家科技巨头的下一代Xbox主机等设备展开深度技术协作。
微软在声明中表示，此次合作将涵盖“跨设备组合的硅芯片联合研发”，下一代Xbox主机赫然在列。Xbox总裁萨拉·邦德(Sarah Bond)同时强调，新一代Xbox平台将聚焦多设备联动，不再局限于自有商店的游戏生态。
“我们致力于构建始终伴随用户的游戏平台，让玩家能在任意设备上畅玩心仪游戏——打造不受单一商店或设备束缚的Xbox体验。”邦德在一分钟的YouTube视频中表示，并补充称新平台将保持与现有Xbox游戏库的兼容性。但她并未提及下一代主机的发布日期，仅透露“新一代Xbox正在成型，这只是开始，我们迫不及待想展示后续规划。”
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