HBM,三星制定新目标

半导体芯闻
18 Jun

如果您希望可以时常见面,欢迎标星 收藏哦~来源:内容编译自zdnet。三星电子开始规划今年下半年的半导体业务战略。三星电子的半导体业务在整个存储器和系统半导体领域都举步维艰,其成败很可能在很大程度上取决于下一代HBM(高带宽存储器)的商业化。美国半导体出口关税和补贴政策的未来走向,预计也将成为三星电子面临的一大变数。据业内人士18日透露,三星电子将于当天召开全球战略会议,由设备解决方案(DS)部门...

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