经纬天地半导体申请晶圆预处理装置及方法专利 有效提高清洗效果

金融界
21 Jun

金融界2025年6月21日消息,国家知识产权局信息显示,江苏无锡经纬天地半导体科技有限公司申请一项名为“晶圆预处理装置及晶圆处理方法”的专利,公开号CN120184067A,申请日期为2025年05月。专利摘要显示,本发明属于半导体制造技术领域,公开了晶圆预处理装置及晶圆处理方法。晶圆预处理装置包括预处理腔体、晶圆固定件、下喷淋组件以及上喷淋组件。预处理腔体内能够容纳晶圆;晶圆固定件被配置为带动...

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