汇集半导体行业资讯 技术前沿、发展趋势!在全球半导体产业竞争白热化的当下,英特尔正全力推进其向全球晶圆代工领导者转型的战略,尤其在2纳米(nm)芯片技术这一关键赛道上,与台积电、三星展开激烈角逐。目前,英特尔的18A工艺处于风险生产阶段,采用1.8纳米技术。该工艺集成了RibbonFET环绕栅极晶体管和PowerVia背面供电等前沿创新技术。这些技术的运用,有望让英特尔制造出更小的晶体管,从而提升...
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