2025年6月18日,全球模拟芯片龙头德州仪器(TI)宣布将在美国得克萨斯州和犹他州投资超600亿美元,建造七座300毫米晶圆厂。这一创美国基础半导体制造领域投资纪录的计划,不仅标志着该公司历史上最大规模的产能扩张,更预示着美国正试图通过重构本土芯片制造能力,重塑全球半导体产业格局。战略布局:跨越三州的制造网络根据规划,这笔投资将分布在三大制造基地:得克萨斯州谢尔曼基地:作为核心扩张区域,首座新厂...
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