破局前行!联电拟于台湾扩产,全力布局先进封装技术

SISC半导体芯科技
23 Jun

来源:网络整理△扫码报名参会近日,半导体行业传出重磅消息,联电作为全球知名的晶圆代工厂商,正积极考虑在台湾地区进行大规模扩产,并同步布局先进封装技术,这一战略决策在业界引发了广泛关注与热烈讨论。联电,全名为联华电子,于 1980 年在台湾创立,是台湾第一家上市半导体公司,其发展历程见证了半导体行业的风云变幻。早年间,联电在半导体领域的地位举足轻重,甚至可与台积电一较高下。然而,在关键的 0.18 ...

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