【苹果(AAPL.US)、高通(QCOM.US)明年或推出2nm芯片 由台积电(TSM.US)代工】智通财经APP获悉,

智通财经
24 Jun
【苹果(AAPL.US)、高通(QCOM.US)明年或推出2nm芯片 由台积电(TSM.US)代工】智通财经APP获悉,Counterpoint Research表示,苹果(AAPL.US)、高通(QCOM.US)和联发科可能会在2026年下半年推出2nm系统级芯片(SoC)‌,新处理器可能由台积电(TSM.US)制造。

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