金融界2025年6月21日消息，国家知识产权局信息显示，吉林大学;沈阳仪表科学研究院有限公司申请一项名为“一种压力传感器及加工方法”的专利，公开号CN120172339A，申请日期为2025年05月。
专利摘要显示，本申请涉及压力传感器领域，尤其涉及一种压力传感器及加工方法，芯片包括硅衬底、二氧化硅介质层、器件层、金属电极以及封装玻璃；器件层包括碳化硅单晶器件层和硅器件层；碳化硅单晶器件层设置在硅器件层上；硅器件层、二氧化硅介质层以及硅衬底依次连接；器件层经刻蚀形成敏感电阻器件层、环形封接区以及微通道；敏感电阻器件层通过微通道与环形封接区隔离；器件层、二氧化硅介质层以及硅衬底经刻蚀形成十字梁刻蚀区域；硅衬底经刻蚀形成硅压力腔体和梁膜；金属电极设置在器件层顶部；封装玻璃阳极键合在器件层的顶部或硅衬底的底部，以解决MEMS压力传感器存在耐高温性和灵敏度低的问题。
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