近日市场传出消息称，晶圆代工大厂联电有意在南科收购瀚宇彩晶厂房。对此，联电响应表示，对于市场传言不予评论。不过针对未来在中国台湾产能规划，联电指出，目前已在新加坡建置2.5D先进封装产能，并已将部分制程拉回中台湾，不排除未来在台扩厂的可能。未来将依据业务发展与整体策略，搭配既有的晶圆对晶圆键合（Wafer to Wafer Bonding）技术，持续在台湾推进更完整的先进封装解决方案。联电目前于...
Source Link近日市场传出消息称，晶圆代工大厂联电有意在南科收购瀚宇彩晶厂房。对此，联电响应表示，对于市场传言不予评论。不过针对未来在中国台湾产能规划，联电指出，目前已在新加坡建置2.5D先进封装产能，并已将部分制程拉回中台湾，不排除未来在台扩厂的可能。未来将依据业务发展与整体策略，搭配既有的晶圆对晶圆键合（Wafer to Wafer Bonding）技术，持续在台湾推进更完整的先进封装解决方案。联电目前于...
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