这类芯片,寒冬已过?

半导体行业观察
28 Jun

公众号记得加星标⭐️,第一时间看推送不会错过。去年摩根士丹利发布的《寒冬将至》报告曾为半导体行业浇下一盆冷水。然而,2025年上半年以来,全球芯片市场正悄然释放出复苏信号。尤其是内存芯片领域,从通用DRAM到高带宽内存(HBM),市场价格回升、库存去化、订单恢复,似乎正在书写“春天将至”的新篇章。信号一:韩国通用DRAM出口激增韩国作为全球DRAM产业的核心基地,其出口数据是观察行业周期的风向标。...

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