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《科创板日报》26日讯，龙芯中科3C6000系列服务器CPU今日发布。据介绍，3C6000单硅片16核32线程，可通过自研的龙链接口通过多硅片封装形成32核64线程的3C6000/D（又称3D6000）及60/64核120/128线程的3C6000/Q（又称3E6000）。据第三方测试报告，3C6000/S、3C6000/D实测单核/多核性能分别达到Intel公司2021年上市的16核至强Silver 4314、32核至强Gold 6338的水平，64核3C6000/Q性能超过40核至强Platinum 8380的水平。结合Intel公司第三代至强可扩展架构服务器芯片出货情况，龙芯中科称3C6000系列服务器CPU综合性能达到2023年市场主流产品水平。（记者 郭辉）

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