兴森科技6月25日在互动平台表示,公司在AI服务器和光模块方向使用的高阶HDI和高频高速PCB目前具备18层以上多层板技术能力。

金融界
25 Jun
兴森科技6月25日在互动平台表示,公司在AI服务器光模块方向使用的高阶HDI和高频高速PCB目前具备18层以上多层板技术能力。

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

Most Discussed

  1. 1
     
     
     
     
  2. 2
     
     
     
     
  3. 3
     
     
     
     
  4. 4
     
     
     
     
  5. 5
     
     
     
     
  6. 6
     
     
     
     
  7. 7
     
     
     
     
  8. 8
     
     
     
     
  9. 9
     
     
     
     
  10. 10