在AI算力需求爆炸式增长的推动下,全球半导体先进封装领域正迎来史无前例的投资与技术革新浪潮。近期,从晶圆代工巨头台积电,到封测领军企业日月光投控、长电科技以及颀中科技,各方均密集公布了在先进封装技术研发、产能扩张和战略布局上的最新进展。颀中科技:FC封测制程将于7月正式量产,并拓展第二增长曲线6月25日,颀中科技宣布,公司自主建设的FC(倒装芯片)封测制程项目将于今年7月份正式进入量产阶段,标志着...
Source Link在AI算力需求爆炸式增长的推动下,全球半导体先进封装领域正迎来史无前例的投资与技术革新浪潮。近期,从晶圆代工巨头台积电,到封测领军企业日月光投控、长电科技以及颀中科技,各方均密集公布了在先进封装技术研发、产能扩张和战略布局上的最新进展。颀中科技:FC封测制程将于7月正式量产,并拓展第二增长曲线6月25日,颀中科技宣布,公司自主建设的FC(倒装芯片)封测制程项目将于今年7月份正式进入量产阶段,标志着...
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