美光上季财报与本季展望出色,持续于高频宽记忆体(HBM)市场攻城掠地,对后段封测委外需求激增,美光将旗下HBM2封装大幅外包,由台厂力成(6239)独家拿下相关大单。美光持续投资HBM、产出续扬,推升后段封测外包订单暴增,力成跟随美光,将成为此波市况爆发的大赢家。随美光大举释出封测委外订单,让力成首度跨足HBM封装市场,预计最快将于今年下半年试产并陆续产出,外界认为,力成后续相关业绩成长动能可期。...
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