全球首发,别克逍遥架构新一代智舱将搭载高通 SA8775P 芯片

IT之家
26 Jun

IT之家 6 月 26 日消息,上汽通用汽车今日宣布与高通、博世达成三方战略合作,共同庆祝全球首个基于高通 SA8775P 芯片开发的智能座舱域控制器样品成功下线。该技术成果将率先应用于别克逍遥超级融合整车架构(下称“别克逍遥架构”),计划于 2025 年下半年在别克高端新能源子品牌“至境”首款轿车上实现全球首发量产。上汽通用汽车介绍称,高通 SA8775P 芯片是专为下一代智能汽车打造的全新一代...

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