金风科技:将于2025年7月18日召开2025年第二次临时股东会

公司公告
27 Jun

金风科技公告,公司董事会决定于2025年7月18日召开第二次临时股东会,会议将采用现场投票与网络投票相结合的方式。会议地点为北京经济技术开发区博兴一路8号公司会议室,审议内容包括《关于为南非控股子公司提供全额担保和代为开具保函额度的议案》。股权登记日为2025年7月11日,H股股东需在2025年7月14日前完成登记。公司将对中小投资者表决单独计票并披露结果。

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