先进封装持续升温,随着台积电不仅斩获英伟达大额订单,更迎来苹果入局——后者明确释放出与台积电在先进封装领域合作的信号,整个行业正密切关注这一进展。到2026年,晶圆级多芯片模块(WMCM)封装的月产能有望达到1万片,用于搭载A20芯片的下一代iPhone。同时,苹果自研的AI服务器芯片也如预期般,逐步开始采用台积电的3D晶圆堆叠SoIC封装技术。WMCM技术是台积电InFO-PoP技术的升级版,...
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