联电,想要进军6nm

半导体产业纵横
30 Jun

本文由半导体产业纵横(ID:ICVIEWS)综合联华电子进军6纳米制程的最大障碍在于其所需的巨额资本支出。据获悉,联华电子(UMC)正在评估进军尖端芯片生产的可行性,该领域由台积电、三星和英特尔主导。四位知情人士表示,联华电子正在探索未来的增长动力,包括潜在的6 纳米芯片生产,这种芯片适用于制造用于Wi-Fi、射频和蓝牙的先进连接芯片、用于各种应用的 AI 加速器以及用于电视和汽车的核心处理器。据...

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