联电力拼6奈米制程迎战全球半导体竞争

全球半导体观察
01 Jul

根据《日经亚洲》的报导,台湾第二大晶圆代工厂联电(UMC)正在评估进军先进制程的可能性,特别是针对6奈米制程的芯片生产。这一领域目前主要由台积电、三星和英特尔主导。联电的高层透露,该公司正在寻找未来的增长动能,6奈米制程将适用于制造先进的Wi-Fi、射频(RF)和蓝牙连接芯片,以及人工智能(AI)加速器和电视、汽车的核心处理器。联电也在考虑扩大与英特尔的合作,特别是在12奈米制程的生产上,双方计划...

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