深南电路(002916.SZ)发布投资者关系活动记录表，公司近期各项业务经营正常，综合产能利用率仍处于相对高位，其中PCB业务因目前算力及汽车电子市场需求延续，近期工厂产能利用率保持高位运行；封装基板业务因近期存储领域需求相对改善，工厂产能利用率较2024年第四季度、2025年第一季度均有所提升。公司FC-BGA封装基板现已具备20层及以下产品批量生产能力，最小线宽线距能力达9/12μm。各阶产品相关送样认证工作有序进行。20层以上产品的技术研发及打样工作按期推进中。
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