台积电美国厂芯片仍需空运回中国台湾进行封装

爱集微
Jul 01, 2025

美国芯片供应链尚未完全实现自给自足。据一份新报告称,台积电亚利桑那州工厂生产的芯片正被运回中国台湾进行封装,以满足来自人工智能(AI)市场的巨大需求。由于台积电难以在美国国内获得最佳封装服务,空运服务的需求将会很高,尤其是在北美。报道称,由于芯片需求旺盛,台积电美国公司正在将准备好的晶圆空运到中国台湾,以获得封装服务,然后将这些芯片提供给AI服务器制造商使用。长荣航空声称,近期对航空物流服务的需求...

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