据消息,苹果(AAPL.US)公司计划在 2026 年推出的 iPhone 18 系列中采用台积电(TSM.US)的下一代 2 纳米制程工艺,并结合先进的 WMCM封装方法。台积电为苹果建2纳米专用产线WMCM 封装技术则在多芯片集成方面表现出色,能够将 CPU、GPU、DRAM 以及其他定制加速器(如 AI / ML 芯片)等复杂系统紧密集成在一个封装内,可提供更大的灵活性,可以在封装内垂直堆叠...
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