SEMICON Taiwan 2025于9月登场,随着AI芯片及HPC需求急剧攀升,全球半导体产业正迎来先进封装的新世代,今年SEMICON Taiwan将聚焦包括3DIC、面板级扇出型封装(FOPLP)、小芯片(Chiplet)、共同封装光学(CPO)等先进封装技术,更令外界关注的是,筹备多时的SEMI 3DIC先进封装制造联盟(SEMI 3DICAMA)也将于本届展会正式启动。今年半导体产业...
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