台积电大力发展的SoW,是什么?

半导体行业观察
Jul 04, 2025

(原标题:台积电大力发展的SoW,是什么?)公众号记得加星标??,第一时间看推送不会错过。台积电正积极研发先进封装技术“晶圆系统(SoW:system over wafer)”,将超大规模、超高速系统集成在直径300毫米的大尺寸硅晶圆或相同直径的圆盘状载体(支撑体)上。SoW通过将多个硅片或微型模块以二维矩阵排列,兼具超大规模、超高速的运算能力、高速、高密度的数据传输,以及降低功耗。将“InFO”...

Source Link

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

Most Discussed

  1. 1
     
     
     
     
  2. 2
     
     
     
     
  3. 3
     
     
     
     
  4. 4
     
     
     
     
  5. 5
     
     
     
     
  6. 6
     
     
     
     
  7. 7
     
     
     
     
  8. 8
     
     
     
     
  9. 9
     
     
     
     
  10. 10