在半导体行业持续演进的进程中,先进封装技术已一跃成为各大晶圆大厂激烈角逐的战略要地。随着摩尔定律逐渐逼近物理极限,传统芯片制程微缩面临重重挑战,先进封装凭借其能够在不依赖制程工艺提升的前提下,实现芯片高密度集成、体积微型化以及成本降低等显著优势,完美契合了高端芯片向更小尺寸、更高性能、更低功耗发展的趋势,从而成为延续摩尔定律和超越摩尔定律的关键路径。值得注意的是,近年来,除了风头颇盛的CoWoS外...
Source LinkDisclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.