英特尔最近对其晶圆代工部门做出了一些“大胆的决定”,尤其是在未来项目方面,例如有消息称,英特尔将不再开发玻璃基板。英特尔新任CEO陈立武宣布,将做出涉及大量重组和原始路线图变更的决策。英特尔晶圆代工部门,在向外部合作伙伴交付工艺方面未能达到预期,而且Intel 18A节点一直受到延迟影响,因此英特尔正在考虑缩减其半导体业务的活动。根据ComputerBase的一份报告,英特尔还将使用外部客户来采购...
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